Registration Dossier
Registration Dossier
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EC number: 231-674-6 | CAS number: 7681-65-4
Surface tension
Administrative data
- Endpoint:
- surface tension
- Type of information:
- experimental study
- Adequacy of study:
- key study
- Reliability:
- 2 (reliable with restrictions)
- Rationale for reliability incl. deficiencies:
- other: Study conducted in compliance with internationally accepted guidelines.
Data source
Reference
- Reference Type:
- study report
- Title:
- Unnamed
- Year:
- 2 013
- Report date:
- 2013
Materials and methods
Test guidelineopen allclose all
- Qualifier:
- according to guideline
- Guideline:
- EU Method A.5 (Surface Tension)
- Deviations:
- no
- Qualifier:
- according to guideline
- Guideline:
- OECD Guideline 115 (Surface Tension of Aqueous Solutions)
- Deviations:
- no
- GLP compliance:
- no
- Type of method:
- ring method
Test material
- Reference substance name:
- Copper iodide
- EC Number:
- 231-674-6
- EC Name:
- Copper iodide
- Cas Number:
- 7681-65-4
- Molecular formula:
- CuI
- IUPAC Name:
- λ¹-copper(1+) iodide
- Details on test material:
- - Name of test material (as cited in study report): Copper iodide.
- Purity: 99.7 %
- Lot/batch No.: 108701/2 REACH STANDARD 290911
Constituent 1
Results and discussion
Surface tension
- Surface tension:
- 72.4 mN/m
- Temp.:
- 20.5 °C
- Remarks on result:
- other: The temperature was 20.5 ± 0.5 °C.
Any other information on results incl. tables
The test item was considered not to be surface active.
Applicant's summary and conclusion
- Conclusions:
- The surface tension of duplicate 90% saturated aqueous solutions of copper iodide was determined to be 72.4 mN/m at 20.5 ± 0.5 °C. The test item was considered not to be surface active.
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